GlobalFoundries Unveils Plans for New $575M Center
The GlobalFoundries campus and company headquarters in Malta. Image provided.
MALTA — GlobalFoundries (GF) recently announced its plans to create a new $575 million center for advanced packaging and testing of American-made essential chips within its New York manufacturing facility in Malta.
Supported by hefty investment from both the U.S. Department of Commerce and New York State, the New York Advanced Packaging and Photonics Center aims to enable semiconductors to be securely manufactured, processed, packaged, and tested entirely in the United States to meet the growing demand for GF’s silicon photonics and other chips needed for end markets including AI, automotive, aerospace and defense, and communications.
GF’s investment in the new center is expected to be $575 million, with an additional $186 million funding research and development over the next decade plus. These investments are expected to create approximately 100 new full-time GF jobs in New York over the next five years.
“The New York Advanced Packaging and Photonics Center will be unique in our industry and will play a vital role in the continued growth of the Empire State’s world-class semiconductor manufacturing and innovation ecosystem,” said Dr. Thomas Caulfield, president and CEO of GF, in a news release.
The New York Advanced Packaging and Photonics Center aims to expand GF’s advanced packaging capabilities – the process of transforming chips into individual packages ready for end-product use – to provide customers an end-to-end U.S.-based solution for chips made at GF’s Malta manufacturing facility. Across the semiconductor industry, most advanced packaging today takes place in Asia.
GlobalFoundries is the third-largest semiconductor foundry in the world. In 2021, it moved its global headquarters from Santa Clara, California to Malta, New York. The company currently employs 2,500 people at its Malta location and has invested more than $16 billion in the facility since it opened in 2011.